Warpage Mechanism of Thin Embedded LSI Packages
نویسندگان
چکیده
منابع مشابه
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ژورنال
عنوان ژورنال: Transactions of The Japan Institute of Electronics Packaging
سال: 2010
ISSN: 1884-8028,1883-3365
DOI: 10.5104/jiepeng.3.47